HANZA Beyers GmbH manufactures your electronics using the SMT process with constant assurance of process quality through automated 3D testing methods such as SPI and AOI.

Technology: modern. Concept: designed for flexibility.
By using jet printers, we can easily place the smallest components (fine pitch) on a PCB at the same time as large components (e.g. connectors). And that without a step stencil.

After the classic solder paste application, paste is individually redispensed so that all components are equipped with exactly the right amount of solder paste. This enables faster response and flexibility for you.

With state-of-the-art placement machines from ASM, we assemble a wide range of SMD and THR components from 01005 to BGA or QFN, for example, with high precision and flexibility. The quality of the placement process stands and falls with the quality of the solder paste application. Therefore, this process is checked inline by state-of-the-art SPI machines and thus always meets the highest quality requirements.

In times of advancing automation of PCB assembly, there are components that are not suitable for SMT design or technology but exist only in THT technology.

In order to still be able to use the technological and economic advantages of SMT technology and reflow soldering for as many of these components as possible, through-hole reflow technology (THR) was developed. We have been successfully using this technology for our customers for more than 15 years.

Beyers assembles in THT technology for you, lead-free and leaded, via solder wave and in hand soldering

HANZA Beyers GmbH manufactures using press-fit technology on request. Solder-free, we ensure reliable and durable connections on your assembly through a precise press-fit process.

HANZA Beyers GmbH protects your printed circuit boards on request by lacquering, selectively, in thick-film or thin-film processes.

Beyers will test your PCBs through the appropriate procedures. This way, you achieve the desired test coverage, and the functionality of your PCBs is ensured at all times.

Whether AOI, ICT, boundary scan, functional test, flying probe or X-ray test. Every test method has its limits in terms of test coverage and fault detection or diagnosis. Increasing miniaturization and the growing complexity of assemblies reinforce this trend. In order to achieve an optimum or maximum test depth, it therefore makes sense to combine test methods. To achieve greater test and fault coverage, the various test systems can be combined in a meaningful way.

We offer complete as well as partially assembled products where HANZA is responsible for testing, configuration and optimization of the entire production flow. The majority of the components are manufactured in our own factories and the remaining parts are sourced-in. Here, our customers benefit greatly from our global supplier network, constantly benchmarked by our sourcing department.

We have extensive experience of handling the entire supply chain, including warehousing, with deliveries directly to our customers’ customers and markets.

We help you with the development of prototypes and facilitate a transition to serial production. Prototypes are configured for immediate volume production. We also offer simulations before prototype production, guaranteeing that details are viable.